The MAX1664 integrates power-supply and backplane drive circuitry for active-matrix thin-film-transistor (TFT) liquid crystal displays. Included are a single-output, pulse-width-modulation boost converter (0.25Ω switch), a dual-output (positive and negative) gate-driver supply using one inductor, an LCD backplane driver, and a simple phase-locked loop to synchronize all three outputs.
High switching frequency (1MHz nominal) and phase-locked operation allow the use of small, minimum-height external components while maintaining low output noise. A +2.8V to +5.5V input voltage range allows operation with any logic supply. Output voltages are adjustable to +5.5V (DC-DC 1) and to +28V and -10V (DC-DC 2). The negative output voltage can be adjusted to -20V with additional components. Also included are a logic-level shutdown and a "Ready" output (RDY) that signals when all three outputs are in regulation.
The boost-converter operating frequency can be set at 16, 24, or 32 times the backplane clock. This flexibility allows a high DC-DC converter frequency to be used with LCD backplane clock rates ranging from 20kHz to 72kHz. The MAX1664 is supplied in a 1.1mm-high TSSOP package.
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LCD ModulesLCD Panels
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Integrates All Active Circuitry for Three DC-DC ConvertersUltra-Small External Components (ceramic capacitors, 2µH to 5µH inductors)DC-DC Converters Phase-Locked to Backplane Frequency for Lowest NoiseLow Operating Voltage (down to +2.8V)Adjustable Output Voltage from VIN to +5.5VLoad Currents Up to 500mAAdjustable TFT Gate Driver Output: Positive, VIN to +28V Negative, 0 to -10V (-20V with added components) Includes 0.35Ω Backplane Driver 1µA Shutdown Current Power-Ready Output Signal
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RDY, IN, BPVDD to GND..........................................-0.3V to +6V
FB2-, PGND1, PGND2 to GND ..........................................±0.3V
LX1 to PGND1 .......................................................-0.3V to +6V
BPVSS to GND.....................................................-3.3V to +0.3V
BPVDD to BPVSS ...................................................-0.3V to +6V
BPDRV to BPVSS ................................-0.3V to (VBPVDD + 0.3V)
LX2P to INP .........................................................-15V to +0.3V
LX2N to PGND2....................................................-0.3V to +30V
SHDN, INP, FB1, FB2+, REF, PLLC,
BPCLK, FPLL to GND................................-0.3V to (VIN +0.3V)
RDY Sink Current ..............................................................20mA
LX2P, LX2N Peak Switch Currents ................................±750mA
Continuous Power Dissipation (TA = +70°C)
20-Pin TSSOP (derate 7mW/°C above+70°C) ............559mW
Operating Temperature Range.............................0°C to +70°C
Junction Temperature....................................................+150°C
Storage Temperature Range ..........................-65°C to +160°C
Lead Temperature (soldering, 10sec) ...........................+300°C
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